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Printed circuit board wiring

With a wide range of grades suited to the demands of specific applications and backed by a reliable technical support team, SUNFORT^TM is widely used for the production of PC motherboards and circuit boards for home electronics.

MPU packaging

The field of microprocessor unit (MPU) package substrates demands ever smaller size and higher performance. Reliable, high-resolution pattern formation of SUNFORT^TM meets the latest and emerging needs in this field.

FPC

With its outstanding adhesion and mechanical strength, SUNFORT^TM enables the production of advanced flexible printed circuits (FPCs) for cell phone and hard disk applications.

COF/TAB

Formation of fine circuit patterns for LCD drivers by chip on flex (COF) and tape automated bonding (TAB) conventionally required liquid photo resist. The availability of high-resolution, low-thickness SUNFORT^TM grades has enabled high-productivity roll-to-roll processing in COF/TAB applications.

Lead frame

With outstanding adhesion and acid resistance, SUNFORT^TM is well suited for lead frame etching.

FC bumping/WLCSP Cu posting

Available with both high thickness and high resolution, SUNFORT^TM enables the formation of fine-pitch bumping at lower process cost.