| Application | Series | Product Type | |
|---|---|---|---|
| PWB & PKG substrate （MCM/BGA/CSP） |
AK | 21（T·P） 22（T) 33（T) 34（T) | |
| AQ | 38（T·P） 59（T·P） 96(T) 9A(T) | ||
| ＦＰＣ | AQ | 75(T) 79(T) | |
| Gold plating | AQ | 38(Au) 86(Au) | |
| Ultra fine Application | SPG | 2(T·P) | |
| UFG | 2(T) 5(T·P) 8(T·P） | ||
| Lead fame & Chemical milling | AQ | 58(T) 59(T) | |
| AKC | 2(T) | ||
| Direct Imaging | ADH | 1(T) 2(T·P) 3(T) | |
| ADV | 1(T) 2(T) 3(T) 4(T) | ||
T:tenting and etching P:plating Au:gold plating
