Notices for use of Hall elements : Important notices: Asahi Kasei Microdevices Magnetic Sensors

Notices for use of Hall elements

Withstand voltage

Please use within the maximum rating and under the recommended operating conditions.
In particular, please take care to avoid high voltage in the element.
The element could be destroyed if the rated range should be exceeded.
Please take measures to protect against surge voltage and static charges in storage, handling, and mounting in a circuit.
Use Hall effect ICs in a manner that does not allow element to make contact with the driving circuit.

Lead forming

Please do not apply excessive force between lead and package when carrying out lead forming.
And, please bend at least 2mm from package to avoid a force on between lead and package, if you bend the lead in the thick direction.

Guaranteed strength value of terminal lead

	300A	300B	101A
Perpendicular strangth (N)	5	5	***
Bending strangth (times)	3	3	3

Soldering conditions

Although the reference conditions are shown as follows, please apply them only after careful examination and confirmation by the customer.

Dipping (dipping entire element)
When dipping is employed, processing in the condition within the temperature load shown in Figure 2 is recommended.
Solder dipping should only be performed once.
Hand soldering (using soldering iron)
Solder under thermal load at 260°C for less than 10 seconds, or 350°C for less than 3 seconds, without touching the body of the element.
Hand soldering should be completed a maximum of two times.
Please inquire of our company about super-mini molding package type.
Reflow
When reflow is employed, processing within the temperature profile shown in Figure 3 is recommended.
Reflow soldering should be completed a maximum of two times.
Solder flux
Colophonium system solder flux is recommended.
Use of an organic acid system, inorganic acid system or water-soluble fluxes should be avoided.

Figure 2: Solder dipping condition

Figure 3: Solder reflow condition

Cleaning

Please follow the procedure below when cleaning solder flux etc.

1.	Cleaning agent	...	Ethanol and isopropyl alcohol
2.	Temperature	...	50°C or less
3.	When ultrasonic cleaning is employed	...	Frequency: 45 kHz or less, Power output: 40 W/liter or less

Notices for circuit design

1.	Semiconductor characteristics/parameters are affected by temperature. Please consider the specified TC(Temperature Characteristic) when designing circuits.
2.	Hall devices can be damaged by excessive supply voltages and static electricity. Please consider these parameters in the design.
3.	Consider adding protective resister in series with supply voltage to avid damage.

Notices regarding storage environment

Please avoid direct sunlight when the products are stored, and keep them at normal room temperature and humidity as far as possible.
(Preferable storage condition is 5°C to 35°C and 40% to 85% RH.)

Notices for long-term storage

If the elements are stored for an extended time (two years or more) under the general storage conditions for semiconductors, the soldering characteristics of the lead terminal and the electrical characteristics could deteriorate; therefore, only use such elements after verifying their soldering and electrical characteristics, etc..
We recommend long-term storage in a nitrogen atmosphere.
The lead of the element will be oxidized by the oxygen in the atmosphere, and the soldering characteristics will deteriorate if the elements are stored in a normal atmosphere.

Precautions for Preventing Electrostatic Discharge

Please bear in mind the following labels when handling Hall Elements with Static Awareness Labels below,
which alert handlers and users of the devices to the possibility of electrostatic damage.

Level of Electrostatic Discharge...Ethanol and isopropyl alcohol

Typical value of breakdown voltage is described below.

	Machine model(*1)	Human body model(*2)
HW-series	200V <	2000V <
HG-series	80V <	800V <
HQ-series	50V <	200V <
HZ-series	100V <	500V <

(*1)EIAJ ED-4701(C=200pF,1time)
(*2)EIAJ ED-4701(C=100pF,R=1.5kO,3times)

The general cautions for Preventing Electrostatic Discharge

(A)	Environment
	One factor which can lead to the generation of electrostatic discharge is the lack of humidity. Humidity should be controled at 40~75%RH in the work environment.
(B)	Workplace
	Conductive floorings (sheetings and coatings) must be used to prevent electrostatic discharge .
(C)	Operators
	Body-grounding articles such as wristband must be worn without fail when touching circuit boards or the devices. Also be absolutely sure to inspect periodically. The antistatic overalls and shoes may be worn.
(D)	Equipment, instrument, and supplies
	The instruments and equipments that handling or touching the devices must be grounded.. When soldering iron is used,it must be grounded without fail. The ionizer may be used,when insulator may touch or approaches.
(E)	The others
	When transporting the devices, use a container that will prevent them from becoming electrostatically charged by housing them , and avoid using the objects which easily become electrostatically charged.

Precautions for Handling and discarding

HG,HZ,HQ-series Hall Element contains gallium arsenide (GaAs)which can be hazardous to the human body and the
environment.
For safety,observe the forrowing procedures;

Handling
Do not put these products into mouth.
Do not alter the form of this product into a gas,powder,liguid through burning,crushing,or chemical processing.
Discarding