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Multilayer structure with thick film minute wiring
| Item |
Specification |
Conductor pitch |
35µm~ |
| Conductor gap |
5µm~ |
| Conductor width |
30µm~ |
| Conductor thickness |
35µm~200µm |
| Product thickness |
0.2mm~ |
| Number of layers |
2~6 layers |
|
Design of wiring resistance
It is possible to design the target resistance at direct current by controlling the conductor pitch by the order of µm.
High flexibility of pattern design
It is possible to mix the different wiring pitch and pattern on the same layer, that cannot be achieved with the traditional winding coil.
AKM will provide the design rule of the latest version. Please contact our sales department with telephone or mail.
Assembly property
It contributes to the efficiency improvement of the assembly work by combining various functions to the same product.
Main combining functions
- Integration of multiple coil units.
- Integration of wiring pattern for part mounting.
- Integration of hole for hall element positioning.
- Integration of sensor pattern.
- Accumulation of different kind material.
I
ntroduction of Assembly property