Electronics Materials business - Photosensitive polyimide/PBO

Electronics Materials business - Photosensitive polyimide/PBO PIMEL™

Photosensitive polyimide/PBO PIMEL™ has been widely used in the worldwide market as semiconductor buffer coating, passivation layer for single bumping and dielectric layer for re-distribution bumping.

PIMEL™ is a liquid photosensitive material based on Polyimide/Polybenzoxazole(PBO) precursor and Novel Phenolic Resin, which has good heat / chemical resistances and electronic / mechanical properties. PIMEL™ has also various products which are suitable for advanced semiconductor packages.

  • 2015/10/01 We had a presentation titled as “TCT Reliability of Organic Passivation Layer for WLCSP” (10/28 2:00 PM) in the IMAPS 2015 (2015/10/27-29).
  • 2015/10/01 We had a presentation titled as “Low temperature curable polyimide for advanced package” (pdf) in the SEMICON Taiwan 2015 (2015/9/2-4).
  • 2015/10/01 We exhibited 3DIC 2015 (2015/8/31-9/2).
  • 2015/07/31 This HP was updated.
  • 2015/05/27 We had a presentation titled as “Design of photosensitive resin compositions with low thermal residual stress” in WCAM-2015 (BIT's 4th Annual World Congress of Advanced Materials - 2015) (2015/5/27-29)
  • 2014/04/01 We had a presentation titled as “Drop Test and TCT Reliability of Buffer Coating Material for WLCSP” in the IEEE Electronic Components and Technology Conference (2014/5/27-30).
  • 2014/04/01 We had a presentation titled as “Analysis of Stress Buffer Effect of Organic Passivation layer for Board Level Reliability Test” in the Symposium on Polymers for Microelectronics(2014/5/6-8).