Photosensitive polyimide/PBO PIMEL ™

Application

Photosensitive polyimide/PBO PIMEL™ has been widely used in the worldwide market as semiconductor buffer coating, passivation layer for single bumping and dielectric layer for re-distribution bumping.
In other industries, PIMEL™ has also been used as photosensitive glue and other new applications with its excellent heat resistances, electronic properties and adhesion strength.

Buffer coating

PIMEL™ protects wafer die from various damages.

  1. Protection from filler attack

    Buffer coating layer protects wiring region on chip from the attack of fillers included in mold resin.

  2. Without PIMEL™ as a buffer coating layer With PIMEL™ as a buffer coating layer
    Without PIMEL™ as a buffer coating layer
    Fillers attack damages wiring region.
    With PIMEL™ as a buffer coating layer
    Buffer coating layer protects wiring region from filler attack
  3. Prevention of soft error

    Buffer coating layer prevents memory elimination (soft error) caused by alpha ray from fillers in mold resin by using shield effect of polyimide and PBO.

    Prevention of soft error

    *Alpha particle from fillers lose its energy through PIMEL™ layer

  4. Stress buffer

    Buffer coating layer reduces residual stress caused by CTE mismatch between mold resin and chip substrate, which prevents cracks on passivation layer and other impacts.

  5. Example of the application
    Example of the application

Bumping

PIMEL™ is used as various protection / insulation layers in the bumping process.

  1. Post passivation layer for single bumping
    Post passivation layer for single bumping
  2. Dielectric layer for re-distribution bumping
    Dielectric layer for re-distribution bumping

Photosensitive glue

PIMEL™ has been used as spacer/glue of air cavity package for MEMS etc. with its excellent reliability and adhesion strength.

photosensitive glue

Others

Coating method : PIMEL™ can be coated by spin coating and slit coating etc.
Substrate : PIMEL™ can be coated on Si wafer, glass and organic substrate etc.