Enhance Reliability and Durability of Electronic Materials
Asahi Kasei's novel silicone-based adhesive features a unique cyclic backbone structure and is free from low molecular weight siloxane gas. It offers high heat resistance and excellent adhesion to glass and ceramics, contributing to improved reliability and durability as an adhesive for electronic materials.
High Heat Resistance Through Introduction of Cyclic Structure
As electronic components become smaller and more powerful, heat generation increases and use in high-temperature environments is required. Asahi Kasei's novel silicone-based adhesive achieves high heat resistance through a uniquely designed cyclic backbone structure. This enables stable performance in high-temperature environments for electronic materials, contributing to longer system life, reduced failure risk, and greater design flexibility.
Excellent Adhesion to Glass and Ceramics
Ceramics, known for their high heat resistance, corrosion resistance, and electrical insulation, are used in various fields such as semiconductor packages and industrial machinery components. Asahi Kasei's novel silicone-based adhesive demonstrates good adhesion not only to SiO₂-based materials like glass but also to representative ceramics such as alumina and zirconia, contributing to the manufacturing processes of composite materials.
Suppress Generation of Low Molecular Weight Siloxane Gas and Prevent Contamination
Low molecular weight siloxane gas generated from conventional silicone-based adhesives can cause malfunctions and increased replacement frequency of electronic components. Asahi Kasei's product suppresses the generation of low molecular weight siloxanes from the material to below the detection limit through molecular structure design and manufacturing process optimization, preventing contamination of surrounding components. This helps prevent lens fogging, poor adhesion, and contact failures in electronic circuits, providing high reliability.
Application development is underway. Please feel free to contact us.
Asahi Kasei's novel silicone-based adhesive suppresses outgassing from low molecular weight siloxanes through molecular structure design and manufacturing process optimization, enabling stable connections and long-term operation in electronic materials where high reliability is required. It is also a clean adhesive that does not use organofluorine compounds as raw materials. Application development is ongoing, so please feel free to contact us if you are interested.
