Sunfort™ Product Information

This series is designed for stepper exposure, featuring high resolution and good chemical resistance. It is widely used in semiconductor package substrate and offers a diverse product lineup to support advanced substrate performance.

This series is a high-sensitivity Dry Film Photoresist (DFR) for LDI exposure , featuring high resolution and good chemical resistance. It is widely used in semiconductor package substrate manufacturing and offers a product lineup for advanced substrates.

This series is designed for Cu pillar formation, enabling three-dimensional semiconductor packaging. With a thickness of 200 µm or more, it offers high resolution and excellent chemical resistance. The lamination process significantly simplifies manufacturing.

Achieves fine patterns of L/S=2/2 µm or less using photosensitive dry film resist technology. Meets the fine circuit requirements of next-generation and future semiconductor package substrates and interposers.