ADP&DA Series for LDI Exposure

LDI Exposure Compatibility: Enables flexible pattern formation through laser direct imaging without using photomasks. Offers exceptional adaptability for custom requirements, prototyping, and design changes with short lead times.

Good Rectangularity: Resist patterns exhibit straight edges with minimal footing, resulting in high-quality copper circuits after plating. This ensures excellent electrical characteristics and stable signal transmission.

Good Chemical Resistance: Exceptional chemical resistance in plating processes for MSAP/SAP methods minimizes resist damage and defects during manufacturing.

High Resolution and High Adhesion: Achieves highly precise pattern formation even for intricate designs, thanks to high resolution and high adhesion to substrates required for fine circuit formation.

Extensive Product Lineup: A comprehensive range covers applications from mass production emphasizing productivity to specialized high-resolution needs. Enables optimization aligned with customer manufacturing requirements.

FC-BGA Type (for High-Performance Servers and AI): Suitable for servers and AI devices demanding high-density, precise circuit formation. LDI technology provides high design flexibility, meeting complex specifications.

FC-CSP Type (for Mobile and Client Devices): Designed for compact, high-performance device substrates, particularly suited for applications such as smartphones and PCs. Supports efficient and precise pattern formation.