TA Series for Fine Circuit Pattern

High resolution and high adhesion technology enables fine circuit patterns of L/S=2/2 µm or less. It meets the fine circuit pattern requirements of next-generation and future semiconductor package substrates and interposers.
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A New Option for Fine Circuit Pattern

The TA Series enables fine circuit patterns of L/S=2/2 µm or less. Using DFR instead of liquid resist enables simple process design and simultaneous double-sided processing. Compatible with both stepper exposure and LDI exposure. Contributes to circuit formation for next-generation and future package substrates. and interposers.

Details of the TA Series

Features: Fine pattern technology of Sunfort™ realizes fine circuit patterns with L/S=2/2 µm or less.

The TA Series is developed by integrating Sunfort™ technologies to meet the fine circuit pattern needs of next-generation and future semiconductor packages. As a dry film type, it enables simultaneous double-sided lamination and simple process design. Compatible with both stepper and LDI exposure, it meets a wide range of customer needs.

Fine Circuit Pattern Capability: The TA Series enables fine circuit pattern with L/S=2/2 µm or less, achieving fine cuicuit pattern required for next-generation semiconductors.

Compatibility with Multiple Exposure Methods: Supports both stepper and LDI exposure methods, covering a wide range from flexible prototype manufacturing requiring frequent design changes to mass production.

Potential Substitute for Liquid Resist: Enables fine circuit pattern previously achievable only with liquid resists and can be a potential replacement for liquid resists.

Ease of use: Ease of use not found in liquid resists, such as simultaneous double-sided lamination and no need for thickness adjustment.

Applications

Interposers: Compatible with next-generation large panel-type interposers, enabling ultra-fine wiring on large-area, double-sided panels.

Advanced Package Substrates: Fine circuit pattern required for substrates used in AI chips and high-speed communication devices.

High-Frequency Devices: Fine circuit pattern essential for high-frequency components used in 5G communications and autonomous vehicles.

Sensor Devices: Fine circuit pattern formation for compact, high-precision sensors embedded in IoT and wearable devices.

Glass Core Substrates: Realizes fine circuit pattern formation on glass substrates anticipated for application in next-generation semiconductor packages and high-speed communication devices.

Resist Pattern

This is an electron microscope image showing the fine resist pattern formation of the TA Series.

Resist Pattern of Sunfort™ TA Series

For Inquiries or Sample Requests

Are you looking for solutions for extremely fine pattern formation? Please consider Sunfort™ "TA Series." For prototype or sample requests, you can contact us via this link.