UFP&SA Series for Stepper Exposure

Dry Film Photoresist (DFR) for stepper exposure with high resolution and good chemical resistance expands the potential for advanced semiconductor package substrates.
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DFR for Advanced Substrate Manufacturing

SUNFORT™ "UFP&SA Series" is designed for stepper exposure. This product enables fine pattern formation and is ideal for manufacturing package substrates that require high-performance circuits. Its high resolution and good adhesion allow for the realization of complex circuit designs.

Details of the UFP&SA Series

Features: Precision Circuits Enabled by High Resolution and Adhesion

High Resolution and Adhesion: The UFP&SA Series offers high resolution and high adhesion necessary for fine pattern formation, supporting precise patterning with stepper exposure.

Good Rectangularity: Exceptional rectangularity with minimal resist footing results in high-quality copper circuits after plating, ensuring superior electrical characteristics and stable signal transmission.

Good Chemical Resistance: Exhibits high resistance to chemicals used in plating processes, minimizing resist damage and ensuring manufacturing stability.

High Sensitivity and Development Speed: Enhanced sensitivity and rapid development increase production line throughput, boosting efficiency in mass production.

Applications

SUNFORT™ "UFP&SA Series" is suitable for manufacturing high-performance package substrates and enables products utilizing advanced technologies such as AI servers and mobile devices. It holds a high market share globally.

FC-BGA Type (for High-Performance Servers and AI): Package substrates specialized for server and AI applications, meeting demands for fine and high-density circuit formation to support advanced computational processing.

FC-CSP Type (for Mobile Devices, etc.) : Designed for substrates used in smartphones and various semiconductor packages, achieving compact and high-density circuit formation.

Resist Pattern

This is an electron microscope image showing the high-precision pattern formation of the UFP&SA Series.

Resist Patterns of SUNFORT™ UFP and SA Series

For Inquiries or Sample Requests

For Prototype or Sample Requests, you can contact us via this link.Please consider SUNFORT™ "UFP&SA Series" for high-density pattern formation using stepper exposure.