High Resolution and Adhesion

Achieving High Resolution and High Adhesion Required for Fine Pattern Formation

SUNFORT™ achieves the high resolution and high adhesion required for fine pattern formation. It is highly regarded in the industry for the following features.

• Expanding Possibilities Through Improved Resolution
  Fine wiring with L/S=2/2 µm or less can be formed. This enables the miniaturization and high density of high-performance devices such as smartphones and AI equipment.
• High Adhesion
  High adhesion to the copper substrate surface enables stable circuit formation and contributes to reduced defect rates.
• Good Rectangularity
  It forms resist patterns with good rectangularity
• Good Chemical Resistance
  It has good resistance to plating solutions

Supporting Customer Competitiveness by Reducing Defect Rates and Increasing Added Value

SUNFORT™ significantly improves the reliability of the manufacturing process through its high resolution and adhesion. Its good chemical resistance reduces resist damage during plating

Asahi Kasei's fine pattern formation technology supports product performance improvement and enhances competitiveness in an increasingly competitive market.

The value provided by SUNFORT™ technology not only solves challenges at manufacturing sites but also contributes to enhancing the future market competitiveness of customers' products.